Siemens Innovation Summit Announcement
Harry Lees • Tech Soft 3D is excited to participate in the 2024 PLM Components Innovation Conference, hosted by Siemens. This event will take place at the Courtyard Downtown Boston Hotel on September 24th & 25th. Will you be able to join us?
This event includes 27 sessions across 2 days, covering everything from industry trends and best practices to customer success stories. Attendees will have the opportunity to network with an all-star lineup of industry experts, C-level executives, and peers. Some big-name presenters include Bradley Rothenberg, István Csanády, Jon Hirschtick.
Software components can be used by organizations of all sizes. This event will highlight how these technologies can empower your team's innovation, providing a more complete product and faster time to market, all while saving developer time and resources.
With presentations and discussions on new 3D data models, digitalization, AI, sustainability, and much more, the Innovation Conference offers developers, end-users, and industry experts a unique opportunity to come together.
Our very own Jonathan Girroir will be presenting on how Tech Soft 3D’s HOOPS Platform can support your data access and visualization needs across a wide range of 3D engineering use cases. HOOPS Exchange allows for fast, fail-free import/export of most popular CAD formats, all through a single API. HOOPS Visualize is the gold standard in 3D engineering visualization for desktop, mobile and XR applications.
“Events like these are a great opportunity to get together with other experts to learn about, discuss, and solve the unique challenges and opportunities present in the 3D engineering software industry. I’m especially excited to talk about advancements in CAD data access and visualization and how we can help those developing innovative software solutions.”
- Jonathan Girroir
Our SDKs are fulling integrated with Siemens Parasolid empowering our partners to take advantage of the leading 3D geometric modeling kernel as they develop their applications.
Join some of the biggest organizations in the industry who have already submitted their RSVP, including PTC, Synera, nTopology, Luminary Cloud, Hyperganic, Shapr3D, Schnitger Corp, and, of course, Tech Soft 3D.
