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Press - February, 2011

28
Feb

Latest version features new and updated formats, enhanced functionality and expanded platform support. Berkeley, CA – February 28, 2011 – Tech Soft 3D, leading provider of component technology to the engineering software industry, is pleased to announce today the latest release of HOOPS 3D Exchange™. Companies can integrate this proven toolkit to develop applications that […]

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04
Feb

Revenue gains fuel aggressive research and development investment. Berkeley, CA – February 4, 2011 Tech Soft 3D, the leading provider of component technology to the engineering software industry, today announced its 2010 revenue grew by a record 40 percent, allowing for an aggressive 60 percent increase in R&D resources. This R&D investment will help further […]

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01
Feb

Latest version includes new material library and seamless integration with HOOPS 3D Exchange™ technology. Berkeley, CA – February 1, 2011 Leading 3D component provider Tech Soft 3D today announced the availability of HOOPS 3D Framework™ (HOOPS 3DF) v19. This newest release features enhancements driven by the hundreds of commercial engineering software teams that rely upon […]

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